Machining technologies and structural models of microfluidic devices

微流控 微通道 表面微加工 机械加工 造型(装饰) 微电子机械系统 粘接 阳极连接 3D打印 纳米技术 光刻 热压连接 扩散焊 平版印刷术 材料科学 工程类 机械工程 胶粘剂 制作 复合材料 光电子学 薄脆饼 医学 替代医学 病理 图层(电子) 冶金
作者
Peiyu Gou,Shaoxin Meng,Huaxin Yan,Jianben Liu,Naichao Chen,Yang Zhao
出处
期刊:Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science [SAGE Publishing]
卷期号:238 (16): 8294-8329 被引量:9
标识
DOI:10.1177/09544062241237705
摘要

In the past decades, microfluidic chips have been one of the hottest research topics in the “lab-on-a-chip” field. However, it is still a challenge for design the perfect microchannels with high functional integration, complex geometry, and high production efficiency. This review paper provides a comprehensive overview of microfluidic structural models and designs, manufacturing techniques, and bonding methods. The effect of three types of microfluidic channel structure models and their configuration parameters on the fluid behaviors of microfluidics was investigated. Surface-to-volume ratio of the flow channel is a critical parameter for determining the mixing and diffusion capabilities of the microfluidic devices (MDs). Thereafter, the main manufacturing techniques for microstructures were discussed, including etching, photolithography, soft lithography, molding, mechanical micro-machining, laser beam micromachining, printing, and 3D printing. We performed a statistical analysis to discuss the relative advantages and disadvantages of these manufacturing methods. In addition, the current bonding methods for MDs were also summarized, including thermal bonding, solution adhesive bonding, dry adhesive bonding, plasma bonding, and anodic bonding. a comparison of different bonding methods was presented to provide a reference to select a suitable bonding method for the assembly of microfluidic device. Finally, the tendencies and challenges of microchannel manufacturing were discussed, and the prospects were also provided.
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