Optimization of morphology and electrochemical characteristics of nickel film by sputtering pressure

Nickel (Ni) films with different structure were prepared on fluorine doped tin oxide (FTO) conducting glass by vacuum magnetron sputtering. In this work the effect of sputtering pressure on morphology and electrochemical performances of the as-prepared Ni films was investigated. The morphology and crystal structure of the prepared Ni films were characterized by scanning electron microscope (SEM) and X-ray diffraction (XRD), respectively. The results show the thickness of Ni films decreased with the increase of sputtering pressure owing to the decrease of the deposition rate from 0.6 Pa to 1.8 Pa with an inflection point at 1.2 Pa. The Ni films deposited at sputtering pressure of 1.2 Pa possess the highest specific surface roughness, porosity and abundant island structure, contributing to better electrochemical performance of Ni film.