Multifunctional Terahertz Spoof Plasmonic Devices

Abstract The next‐generation wireless communications and intrachip and interchip communications require high‐speed terahertz (THz) interconnects. The interconnects based on spoof surface plasmon polaritons (SSPPs) provide a possible route to achieve this goal. Recently, some THz plasmonic devices are explored, but they suffer from bulk sizes and/or single function. Herein, planar multifunctional THz plasmonic devices based on the interaction between SSPPs and spoof localized surface plasmon (SLSPs) including the functions of pass‐through transmission, multifrequency resonances, and phase shift are proposed and experimentally demonstrated. The pass‐through transmission can be realized on the SSPP waveguide by increasing the loss of the coupled SLSP resonator; the multifrequency resonances are obtained by placing the SU‐8 films with different thicknesses on the SLSP resonator due to its high sensitivity; and the phase shift can be achieved by integrating the SU‐8 film on the SSPP waveguide due to the flexible dispersion behaviors of SSPPs. The proposed multifunctional THz plasmonic devices hold great promise for the THz on‐chip integrations, wireless communications, and sensing systems.