沟槽(工程)
计算机科学
光电子学
材料科学
冶金
作者
Chong Zhang,Chip Greely,Jianhua Li,Li-Fan Yang,Alex J. Hsieh,Haiwei Lu,Neil V. Sapra,John M. Fini,Varun Chandrasekar,LK Bhupathi,Vladimir Stojanović,Chen Sun,Pooya Tadayon,Mark T. Wade
标识
DOI:10.1364/ofc.2025.th3h.2
摘要
This paper presents connectorized in-package optical I/O chiplets with V-groove for passive fiber attach, enabling robust and scalable connectivity solutions for AI and high-performance compute. We demonstrate a process for ensuring known good chiplets using Ayar Labs’ TeraPHY™ optical I/O chiplet.
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