A resveratrol based active ester cured epoxy film with low dielectric loss and high thermal performances

The production of epoxy resins with low dissipation factor (Df) remains an alluring yet challenging task. In this work, we successfully synthesized a novel resveratrol based active ester (ResE) by a one-step method using the renewable resveratrol as raw material. The structure of ResE was characterized using FTIR and NMR techniques. The phenol biphenyl epoxy (SQXN-324) was cured with ResE, the SQXN/ResE system boasted a favorable dielectric constant (Dk) of 2.78 and dissipation factor (Df) of 3.5 × 10−3 at a high frequency of 10 GHz. Additionally, the SQXN/ResE system exhibited impressive thermal performances, with a 5 % weight loss temperature (T5%) of 368 °C, a residual carbon of 34 wt% at 800 °C in N2 atmosphere, a glass transition temperature (Tg) of 154 °C, a coefficient of thermal expansion (CTE) of 61.9 ppm/°C from 25 °C to Tg and the CTE of 130 ppm/°C from Tg to 250 °C. These findings suggested that a biomass curing agent for epoxy with low Df and high thermal performances were successfully developed, it had potential applications in the high frequency communication field and microelectronics industry.