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88 积分 2025-04-09 加入
Development of Artificial Neural Network and Topology Reconstruction Schemes for Fan-Out Wafer Warpage Analysis
8天前
已完结
A new method for prediction of 2D chip temperature distributions in general purpose drive load profiles
11天前
已完结
Electro-Thermal Device-Package Co-Design for Ultra-Wide Bandgap Gallium Oxide Power Devices
14天前
已关闭
TCAD simulation methodology for electrothermal analysis of discrete devices including package
15天前
已完结
Silicon carbide MOSFETs: A critical review of applications, technological advancements, and future perspectives
17天前
已完结
Effects on thermal performance enhancement of pin-fin structures for insulated gate bipolar transistor (IGBT) cooling in high voltage heater system
17天前
已完结
Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management
17天前
已完结
Multi-objective topology optimization design of silicon carbide metal oxide semiconductor field effect transistors power module liquid-cooled heatsink for electric vehicles
18天前
已完结
Multi-objective topology optimization design of silicon carbide metal oxide semiconductor field effect transistors power module liquid-cooled heatsink for electric vehicles
23天前
已完结
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