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198 积分 2025-04-09 加入
Fast and Distributed Thermal Model for Thermal Modeling of GaN Power Devices
1个月前
已完结
High-Efficiency Green Function-Based Thermal Simulation Algorithms
1个月前
已完结
Thermal failure in semiconductor devices
1个月前
已关闭
Design and Test of a Low Junction-to-Case Thermal Resistance Packaging Method
1个月前
已完结
Research on Thermo-Hydro-Mechanical Coupling Characteristics in Lead-Bismuth Cooled Inverted Fuel Assemblies
4个月前
已完结
Effect of junction temperature on 1.3 µm InAs/GaAs quantum dot lasers directly grown on silicon
4个月前
已完结
Time-dependent-dielectric-breakdown measurements of thermal oxides on n-type 6H-SiC
4个月前
已完结
Lifetime tests of 600-V GaN-on-Si power switches and HEMTs
4个月前
已完结
Correlation of the microstructure and mechanical properties of oxide-dispersion-strengthened coppers fabricated by internal oxidation
4个月前
已完结
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