离子液体
介电谱
循环伏安法
电化学
线性扫描伏安法
无机化学
扫描电子显微镜
镍
电镀
钴
吸附
电解质
材料科学
化学
伏安法
离子键合
电极
离子
冶金
物理化学
纳米技术
催化作用
有机化学
图层(电子)
复合材料
作者
Inam M.A. Omar,Khadijah M. Emran,Mustafa Kamal Abdul Aziz,Abdo Mohammed Al-Fakih
出处
期刊:RSC Advances
[The Royal Society of Chemistry]
日期:2020-01-01
卷期号:10 (53): 32113-32126
被引量:9
摘要
Thin films of Co and Ni electroplated onto a copper electrode from acidic sulfate and Watts baths, respectively, were investigated. The use of an ionic liquid additive in the electrolyte is widespread for producing thin films by electrodeposition. In the present work, the influence of a new ionic liquid, namely, 1-methyl-3-((2-oxo-2-(2,4,5-trifluorophenyl)amino)ethyl)-1H-imidazol-3-ium iodide (Im-IL), in the electrodeposition of two metals was investigated using cathodic polarization (CP), cyclic voltammetry (CV), and anodic linear stripping voltammetry (ALSV) measurements and cathodic current efficiency (CCE%). The surface morphology of the Co- and Ni-coated samples was examined using Scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX), X-ray diffraction (XRD) and atomic force microscopy (AFM). The corrosion protection of the Co and Ni samples in a marine environment (3.5% NaCl solution) was studied by the potentiodynamic polarization and electrochemical impedance spectroscopy (EIS) techniques. The results show that the addition of Im-IL inhibits Co2+ and Ni2+ deposition, which leads to more fine-grained deposits, especially at low Im-IL concentrations. The inhibition of Co2+ and Ni2+ reduction in the presence of Im-IL ions occurs via adsorption, which obeys the Langmuir adsorption isotherm. The CCE% is higher in the presence of Im-IL. SEM images show smoother deposits of Co and Ni in 1 × 10-5 M and 1 × 10-4 M Im-IL solution respectively. The results prove that Im-IL acts as an efficient additive for electroplating soft Co and Ni films.
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