材料科学
聚酰亚胺
电介质
复合材料
光电子学
介电强度
薄膜
储能
化学工程
作者
David H. Wang,Brian A. Kurish,Imre Treufeld,Lianyun Yang,Lei Zhu,Loon-Seng Tan
出处
期刊:MRS Proceedings
[Springer Nature]
日期:2013-12-01
卷期号:1541 (1): 72201-72206
被引量:1
摘要
Two new diamines containing three nitriles are synthesized via a 3-step route. They are polymerized with four commercial dianhydrides (i.e. 6FDA, OPDA, BTDA and PMDA) in N,N-dimethylacetamide (DMAc) to afford poly(amic acid)s, which are thermally cured at temperatures up to 300 °C to form tough, creasable films. Most of these polyimides are soluble in common solvents. Their glass transition temperatures range from 216 to 341 °C. The polyimides are stable up to 400 °C. The dielectric constants of these OPDA-based polyimides increase from 2.9 (CP2) to 4.7 as measured by the D-E loops.
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