Abrasive-free chemical-mechanical planarization (CMP) of gold for thin film nano-patterning

Despite high demand for gold film nanostructuring, patterning gold at the nanoscale still presents considerable challenges for current foundry-compatible processes. Here, we present a method based on abrasive-free chemical mechanical planarization (CMP) to planarize nanostructured gold surfaces with high selectivity against SiO