Heterogeneous integrated InP/SiC high-performance multilevel RRAM

With the advent of the Age of Big Data, resistive random-access memory (RRAM) shows considerable potential for next generation nonvolatile storage technologies owing to its simplified structure, high switching speed, and low power consumption. However, mainstream prepared materials, such as oxides and halide perovskite, face critical issues for practical applications such as switching uniformity and long-term environmental stability. In this work, we report that high carrier mobility material indium phosphide (InP) is prepared as an RRAM medium and is directly bonded to the high thermal conductivity substrate silicon carbide (SiC) at 200 °C, overcoming large (14.9%) lattice mismatch. Importantly, the bonding strength reaches 9.3 MPa, and this high-performance stable RRAM exhibits nonvolatile and reliable switching characteristics including stable endurance (200 cycles) and long data retention (2000 s). Moreover, multilevel storage is also available by modulating RESET stop voltages. This work provides broad possibilities for high-performance RRAM with structures based on traditional semiconductors in the field of nonvolatile storage.