Dielectric Planarization using Mn2O3 Slurry

We have developed an Mn2O3 slurry for dielectric planarization for the first time. Our Mn2O3 slurry has 4 times the removal rate of conventional slurry. The removal rate for this slurry remains constant for between l wt% and 10 wt% solid concentration. Pad-conditioning-free polish was successfully realized. We demonstrated that this slurry is reproducible.