Weighted grey relational analysis to evaluate multilevel dispatching rules in wafer fabrication

托普西斯 灰色关联分析 晶圆制造 计算机科学 水准点(测量) 层次分析法 数据挖掘 基础(线性代数) 维柯法 排名(信息检索) 运筹学 工业工程 可靠性工程 数学优化 多准则决策分析 数学 薄脆饼 工程类 人工智能 统计 电气工程 几何学 大地测量学 地理
作者
Goh Chia Yee,Jeng Feng Chin,Mohd Azizi Chik,M. Mokhtar
出处
期刊:Grey systems [Emerald Publishing Limited]
卷期号:11 (4): 619-649 被引量:6
标识
DOI:10.1108/gs-08-2020-0106
摘要

Purpose This research proposes weighted grey relational analysis (WGRA) method to evaluate the performance of 325 multilevel dispatching rules in the wafer fabrication process. Design/methodology/approach The research methodology involves multilevel dispatching rule generation, simulations, WGRA and result analysis. A complete permutation of multilevel dispatching rules, including the partial orders, is generated from five basic rules. Performance measures include cycle time, move, tool idling and queue time. The simulation model and data are obtained from a wafer fab in Malaysia. Two seasons varying in customer orders and objective weights are defined. Finally, to benchmark performance and investigate the effect of varying values of coefficient, the models are compared against TOPSIS and VIKOR. Findings Results show that the seasons prefer different multilevel dispatching rules. In Normal season, the ideal first basic dispatching rule is critical ratio (CR) and CR followed by shortest processing time (SPT) is the best precedence pairing. In Peak season, the superiority of the rule no longer heavily relies on the first basic rule but rather depends on the combination of tiebreaker rules and on-time delivery (OTD) followed by CR is considered the best precedence pairing. Compared to VIKOR and TOPSIS, WGRA generates more stable rankings in this study. The performance of multicriteria decision-making (MCDM) methods is influenced by the data variability, as a higher variability produces a much consistent ranking. Research limitations/implications As research implications, the application illustrates the effectiveness and practicality of the WGRA model in analyzing multilevel dispatching rules, considering the complexity of the semiconductor wafer fabrication system. The methodology is useful for researchers wishing to integrate MCDM model into multilevel dispatching rules. The limitation of the research is that the results were obtained from a simulation model. Also, the rules, criteria and weights assigned in WGRA were decided by the management. Lastly, the distinguishing coefficient is fixed at 0.5 and the effect to the ranking requires further study. Originality/value The research is the first deployment WGRA in ranking multilevel dispatching rules. Multilevel dispatching rules are rarely studied in scheduling research although studies show that the tiebreakers affect the performances of the dispatching rules. The scheduling reflects the characteristics of wafer fabrication and general job shop, such as threshold and look-ahead policies.

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