An Accurate Simulation Method of Package Warpage Experimental Results Based on FEM

In order to realize the diversification of electronic products, it is necessary to integrate more electronic devices, which leads to more and more substrate circuit density, resulting in the increase of package size and the number of substrate layers. At the same time, the mismatch of thermal expansion coefficient of packaging materials is becoming more and more serious, which is bound to lead to larger package warpage. Large warpage may lead to substrate delamination, solder joint cracking and bump electromigration failure, etc. At the same time, it will also cause problems in the placement of electronic devices, which will affect the reliability of the whole package. Therefore, how to have an accurate prediction of package warpage in the early stage of packaging is a difficult problem that needs to be solved urgently. In this paper, based on ANSYS Workbench software, using the method of equivalent packaging materials and equivalent substrate, the warpage values of different packaging forms and sizes are simulated, and compared with the average value of shadow moire results, and the error is less than 13%, which greatly improves the simulation accuracy.