Enhanced thermal conductivity of polyamide‐66 composites with mesocarbon microbeads through simple melt blending

Abstract In this work, composite samples were fabricated through melt blending with mesocarbon microbeads (MCMBs) and polyamide‐66 (PA66). Noteworthily, the thermal conductivity (TC) of the composites reached 1.51 W/m K with 60 wt% MCMBs, and the mechanical properties and heat resistance of PA66/MCMB composite were significantly improved. It was mainly due to the formation of heat transfer network at high filler content and their good dispersion in the matrix. The present work provided a new selection of thermally conductive fillers and expanded the application of MCMB in thermal management materials.