Effects of sandwiched film thickness and cutting tool water contact angle on the processing outcomes in nanoskiving of nanowires

To calculate the shear yield stress and effect of the gold film thickness on sandwich structures, a force transducer was used to measure cutting forces during nanoskiving, and an orthogonal cutting model, which considered liquid parameters, was used for analysis the slicing process. Sandwich structures with gold film thicknesses of 50 nm and 150 nm were prepared. The contact angles between the water surface in the trough and its edge line were 0° (horizontal) and 35° (protruding) during slicing. The cutting feed of the slab should be < 430 nm for sandwich structures with a 50-nm gold film thickness and < 344 nm for a 150-nm gold film thickness to ensure dimensional accuracy. The sandwich structure with a gold film had a higher shear yield stress than a pure epoxy structure. Increasing the thickness of the gold film and the contact angle with the water surface decreased the strength of the structure, thereby facilitating cutting. In accordance with a comparison of segmented cutting-force curves for the sandwich structure, this characteristic is a result of different adhesions between the resin and metal film. Thus, researchers should improve epoxy material preparation to reduce adhesion of the material and improve the stability of the slicing.