溶解
材料科学
奥氏体不锈钢
图层(电子)
奥氏体
萨斯
腐蚀
硼
冶金
化学工程
复合材料
化学
微观结构
有机化学
程序设计语言
工程类
计算机科学
作者
Tong-Hao Wang,Jian Wang,Jingang Bai,Shujing Wang,Chao Chen,Peide Han
标识
DOI:10.1007/s42243-021-00693-0
摘要
The impact of boron on the dissolution and repairing behavior of passive films formed on S31254 super-austenitic stainless steel (SASS) was investigated. SASS was immersed in 0.5 mol/L of H2SO4 for 0, 2, 6, 10, and 14 days to explore the evolution of the passive film. The electrochemical impedance spectroscope (EIS), the Mott–Schottky analysis, and X-ray photoelectron spectroscope were utilized to analyze the semiconductor properties and compositions of the passive films. EIS showed a decrease and consequent increase over 14 days; the same pattern was observed for Cr2O3 and Cr/Fe. However, the defect density of the passive film exhibited a reverse trend. The variation in film thicknesses indicated that the passive films possessed dissolution and repairing behavior. SASS passive film had a double-layer structure; the outer layer was found to be rich in Fe3+ and Cr(OH)3, but low on Mo6+, while the inner layer was rich in Cr2O3 and low in Mo4+. The addition of boron increased the corrosion resistance and could promote the efficiency of the passive film repair, likely by promoting the migration of Mox+, which promoted the repairing of the passive film.
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