电镀
材料科学
极限抗拉强度
铜
粒度
延展性(地球科学)
微观结构
电流密度
复合材料
冶金
热稳定性
蠕动
化学
图层(电子)
有机化学
物理
量子力学
作者
Chuan-Yu Fang,Dinh-Phuc Tran,Hung-Che Liu,Jia-Juen Ong,Yi-Quan Lin,Wei-You Hsu,Chih Chen
标识
DOI:10.1149/1945-7111/ac62be
摘要
In this study, nanotwinned copper (nt-Cu) foils were fabricated using a rotary electroplating system. Their microstructures (orientation, grain size, and twin spacing) and correlated tensile properties were substantially tuned by manipulating the electroplating current density. The nt-Cu foils were further heat-treated at 150 °C for 1 h and tensile-tested to characterize their thermal stability. We found that the mechanical properties of the nt-Cu foils are directly associated with the electroplating current density. The ultimate tensile strength (UTS) increases with increasing in the current density, reaching the maximum values at 25 ASD. The great enhancement can be attributed to the decrease in twin spacing and grain size. We also discovered that the UTS and ductility remain approximately intact under a high temperature, indicating the excellent thermal stability of such nt-Cu foils.
科研通智能强力驱动
Strongly Powered by AbleSci AI