Research Status of Diffusion Bonding of Ti-Cu

The Ti-Cu vacuum diffusion bonding process and mechanism research of the present status in China and abroad was studied.The solid phase direct diffusion bonding and the middle layer diffusion bonding was introduced.The relationships between strength,the diffusion solution layer thickness and bonding temperature,holding time,the diffusion pressure were discussed.The mechanism of atomic diffusion bonding was explored.The basis and insufficient of the mechanism was pointed out.Finally,the future development trend of the Ti-Cu vacuum diffusion bonding process and research direction of diffusion bonding mechanism were studied.