倒装芯片
可靠性(半导体)
残余应力
焊接
残余物
炸薯条
材料科学
回流焊
电子工程
过程(计算)
电子包装
作者
Se Young Yang,Young-Doo Jeon,Soon-Bok Lee,Kyung-Wook Paik
标识
DOI:10.1016/j.microrel.2005.06.007
摘要
To meet the future needs of high pin count and high performance, package size of flip-chip devices is constrained to become larger. In addition, to fulfill the environment issues, lead free solders will be replacing lead contained eutectic (Sn/37Pb) in near future. Thus, in this work, the effect of residual warpage and consequent residual stress on the reliability of large flip-chip using lead free solder is examined. Several effective experimental approaches to accurately measure residual warpage, using Moire interferometry, shadow Moire, and image processing schemes, are introduced. Moreover, geometric, process, and material parameters affecting the residual warpage during reflow process are discussed and some modifications are suggested. Finally, it is verified that it is crucial to accurately quantify and control the residual warpage in order to guarantee the overall reliability of flip-chip packages regardless of presence of underfill.
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