材料科学
薄膜晶体管
多晶硅
纳米技术
非晶硅
硅
制作
光电子学
晶体管
半导体工业
半导体
集成电路
薄膜
工程物理
电气工程
晶体硅
制造工程
工程类
图层(电子)
病理
电压
替代医学
医学
标识
DOI:10.1002/adma.200803211
摘要
Abstract Thin‐film transistors (TFTs) matured later than silicon integrated circuits, but in the past 15 years the technology has grown into a huge industry based on display applications, with amorphous and polycrystalline silicon as the incumbent technology. Recently, an intense search has developed for new materials and new fabrication techniques that can improve the performance, lower manufacturing cost, and enable new functionality. There are now many new options – organic semiconductor (OSCs), metal oxides, nanowires, printing technology as well as thin‐film silicon materials with new properties. All of the new materials have something to offer but none is entirely without technical problems.
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