电介质
材料科学
介电损耗
耗散因子
复合材料
聚酰亚胺
介电常数
微电子
光电子学
电子工程
图层(电子)
工程类
作者
Masao Tomikawa,Hitoshi Araki,Yohei Kiuchi,Akira Shimada
出处
期刊:IMAPS symposia and conferences
[IMAPS - International Microelectronics Assembly and Packaging Society]
日期:2018-10-01
卷期号:2018 (1): 000476-000482
被引量:4
标识
DOI:10.4071/2380-4505-2018.1.000476
摘要
Abstract Progress of 5G telecommunication and mm radar for autopilot, high frequency operation is required. Insulator materials having low loss at high frequency is desired for the applications. We designed the low dielectric constant, and low dielectric loss materials examined molecular structure of the polyimide and found that permittivity 2.6 at 20GHz, dielectric loss 0.002. Furthermore, in consideration of mechanical properties such as the toughness and adhesion to copper from a point of practical use. Dielectric properties largely turned worse when giving photosensitivity. To overcome the poor dielectric properties, we designed the photosensitive system. After all, we successfully obtained 3.5 of dielectric constant and 0.004 of dielectric loss, and 100% of elongation at break. In addition, we offered a B stage sheet as well as varnish. These materials are applicable to re-distribution layer of FO-WLP, Interposer and other RF applications for microelectronics.
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