EXAMPLES OF USING THE ANALYTICAL STRUCTURAL FUNCTIONS FOR THE THERMAL ANALYSIS OF SEMICONDUCTOR DEVICES

Thermal analysis of semiconductor devices includes determination of thermal resistance of the chip, the case and the heatsink separately. Nowadays, the thermal analysis is carried out with the thermal structural functions obtained by the numerical deconvolution method. In this paper we experimentally show a possibility of performing the thermal analysis and determining the junction-to-case thermal resistance with the analytical thermal structure functions applied to certain diodes and transistors. The proposed technique can be used to improve the quality of thermal design and also in the screening tests of semiconductor devices, when it is necessary to know separate thermal resistances of the components.