比较器
炸薯条
直线(几何图形)
电气工程
符号
晶体管
电压
计算机科学
拓扑(电路)
数学
工程类
算术
几何学
作者
Mingdong Li,Shalin Huang,Fang Tang
出处
期刊:IEEE Transactions on Circuits and Systems Ii-express Briefs
[Institute of Electrical and Electronics Engineers]
日期:2022-11-16
卷期号:70 (4): 1296-1300
被引量:1
标识
DOI:10.1109/tcsii.2022.3222908
摘要
This brief introduces a over-temperature protection (OTP) circuit used in line driver chip for PLC applications. For the limitations of the BJT process, the proposed circuit adopts a current distribution structure with a positive loop to realize state switching if the temperature exceeds the threshold or recovers, instead of the traditional structures with integrated comparators in the CMOS process. The method minimizes quiescent current (IQ) and transistor consumptions of the circuit. In addition, due to no comparator exists, there is no need for reference voltage, so that the process and voltage stabilities of the circuit are improved. The OTP circuit is implemented by SOI-BJT process, and relies on a line driver chip for verification. The module consumes 5- $\mu A$ IQ, which only accounts for 0.02% of the whole chip. The measured maximum temperature drift of the circuit is $0.167\,^{\circ }\mathrm {C/V}$ under the power supply voltage range of 6-30V, and the average hysteretic temperature drift of 6 random sampled chips is $0.15\,^{\circ }\mathrm {C}$ .
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