材料科学
模数
粒度
杨氏模量
微观结构
多孔性
复合材料
弹性模量
体积模量
冶金
作者
Yanchun Zhou,U. Erb,K.T. Aust,G. Palumbo
出处
期刊:International Journal of Materials Research
[De Gruyter]
日期:2003-10-01
卷期号:94 (10): 1157-1161
被引量:3
标识
DOI:10.1515/ijmr-2003-0209
摘要
Abstract The interface effect on Young’s modulus was investigated in electro-deposited fully-dense Ni –P alloys with a relatively constant phosphorus content (2– 3 wt%), but with different grain sizes ranging from 4 to 29 nm. Essentially the same Young’s modulus was observed for grain sizes ≥ 18 nm. A noticeable decrease in Young’s modulus was found at grain sizes ≤ 17 nm. The reduction in Young’s modulus was found to correlate well with the increase in all interface contributions. These observations agree with various studies on other fully-dense metals for grain sizes between 5 and 80 nm. Previously reported large decreases in the Young’s modulus were likely caused by the significant amount of porosity in the microstructure.
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