Flow Field‐Induced One‐Step Electrodeposition Process to Fabricate Superhydrophobic Films for Flexible Electronics

Abstract Widely used flexible electronics are vulnerable to liquid infiltration during working, and the superhydrophobic surface has an available protective effect. In this work, a flow field‐induced one‐step electrodeposition method is used to fabricate superhydrophobic films. The main components are cerium myristate (CeM) and carboxylated multi‐walled carbon nanotubes (MWCNTs‐COOH). The morphology of the films changes a lot due to the addition of MWCNTs‐COOH from granular structure to network structure. The faster rotation of solution makes the deposition of MWCNTs‐COOH more uniform without vertical patterned stripes and smoother surfaces. The films’ deionized water contact angles are not affected, but the sliding angles decline distinctly because of the smoother surface. Besides, two competing flow fields and electric fields will degrade the wettability of the films electrodeposited for a short time at 10 V. Electrochemical performance tests and abrasion tests are employed to examine if the superhydrophobic films can withstand abrasions, impacts, and electrochemical corrosion. The lowest electric resistivity of the films reaches 56.1 ± 4.3 mΩ mm. In the end, a light‐emitting diode bulb connected to a simple, flexible circuit prepared by a selective mask method can glow, which also proves its potential for applications in flexible electronics.