Low-temperature curable and low-dielectric polyimide nanocomposites using aminoquinoline-functionalized graphene oxide Nanosheets

Low-temperature curable and low-dielectric polyimides (PIs) are required in wafer-level packaging (WLP) which is an advanced microelectronic packaging technology. Herein, a low-cost and multifunctional nanofiller (aminoquinoline-functionalized graphene oxide , AQL-GO) is synthesized, which ingeniously achieved the above-mentioned requirements of polyimide nanocomposites by nucleophilic attack of QL and chaotic packing of the polymer chain. The results show that the nanocomposite can be fully cured at only 200 °C and have a low dielectric constant ( 2.96@1 MHz) with 0.5 wt% addition of AQL-GO. Furthermore, the mechanical and thermal properties of all nanocomposites cured at 200 °C (the elongation at break can reach 39.69%, the Young's modulus can reach 2.38 GPa and T 5% can reach 530.55 °C) are almost equal or even better than those of pure PI cured at 350 °C. Therefore, the PI/AQL-GO nanocomposites have industrial prospects in advanced microelectronic packaging. Low-temperature curing (200 °C) and low-dielectric (2.96@1 MHz) polyimide/aminoquinoline-functionalized graphene oxide (PI/AQL-GO) nanocomposites have been synthesized for next-generation microelectronic packaging. • Polyimide/aminoquinoline-functionalized graphene oxide (PI/AQL-GO) nanocomposites were successfully synthesized. • The nanocomposites can be fully cured at 200 °C and possess low dielectric constant (2.96@1 MHz). • The nanocomposites also possess excellent mechanical and thermal properties. • In situ grafting process was proposed to explain the mechanism.