High-transmission EUV pellicles supporting >400W source power

EUV lithography has been adopted worldwide for High-Volume Manufacturing (HVM) of sub-10nm node semiconductors. To support HVM, EUV pellicles were introduced by ASML in 2016, and more recently, pellicles made from novel materials were developed to offer higher transmission and support higher source powers. In this paper, we will give an overview of current EUV pellicles. Also, we will report on our continuing research to optimize EUV pellicles to transmissions of above 90%, and supporting EUV source powers of above 400W. Key performance indicators of such novel pellicles will be presented, showing the promise of these materials to support upcoming lithography nodes.