Fully Integrated Voltage Regulators with Package-Embedded Inductors for Heterogeneous 3D-TSV-Stacked System-in-Package with 22nm CMOS Active Silicon Interposer Featuring Self-Trimmed, Digitally Controlled ON-Time Discontinuous Conduction Mode (DCM) Operation

A 10-tile buck IVR using 0.9nH-1.4nH 3D-TSV-based package-embedded inductors demonstrates up to 37.6% higher efficiency than LDO. Communication-free inter-tile ganging is achieved with flat efficiency over a 10mA-1A load range. Stability-aware interleaving of IVR tiles in DCM shows up to 34% reduction in output ripple compared to zero interleaving.