Co-optimization of electrical-thermal–mechanical behaviors of an on-chip thermoelectric cooling system using response surface method

Thin-film thermoelectric coolers (TFTECs) have emerged as a potentially optimal solution for on-chip cooling. Most previous optimization studies have focused on improving the cooling performance of TFTECs. However, a fully functional and robust TFTEC requires a combination of performance, reliability, and power consumption in 3D integration with comprehensive consideration of electrical-thermal–mechanical coupling effects. In this work, a system-level co-optimization of an on-chip thermoelectric cooling system is performed using an electrical-thermal–mechanical coupling model. Response surface method is used to obtain predictive models to evaluate the performance of TFTEC with respect to leg height, electrode height, electrical and thermal contact resistances. The interactions between the design factors and their effects on device resistance, active cooling, and thermal stress are investigated. The results reveal that electrode height is the most critical factor affecting device resistance and active cooling. Leg height is the most important factor affecting maximum thermal stress. Based on multi-objective optimization, the optimal configuration of design factors is obtained. A device resistance of 5.75Ω, active cooling of 3.8°C, and thermal stress of 1646.2MPa can be achieved simultaneously. Compared to the initial configuration, device resistance is increased by 4.9%, active cooling is increased by 111%, and thermal stress is reduced by 3.4%.