Creep and creep fracture of polycrystalline copper

Abstract Normal creep curves are recorded over extended stress ranges at 686–823 K for fine-grain copper. Analyses of the curve shape variations, together with the results of stress change experiments, do not support the view that a transition from dislocation to diffusional creep mechanisms occurs with decreasing stress. Instead, the observed behaviour patterns suggest that dislocation processes are dominant at all stress levels. However, strain accumulation within the grains becomes progressively less important as deformation is increasingly confined to the grain boundary zones when the stress is reduced below the yield stress at the creep temperature. New approaches are then introduced for rationalization of creep rate and creep life measurements, which account for the data trends taken as evidence for major mechanism changes when the creep properties are described using power law relationships.