原电池
电偶腐蚀
冶金
焊接
铜
钝化
腐蚀
氯化物
材料科学
电流(流体)
浸出(土壤学)
电偶阳极
氯化铅
铅(地质)
污染
海水
阴极保护
电化学
化学
电极
复合材料
环境科学
地质学
海洋学
土壤水分
生物
土壤科学
物理化学
图层(电子)
地貌学
生态学
作者
Caroline Nguyen,Kendall R. Stone,Abhijeet Dudi,Marc Edwards
摘要
As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH < 2.5 and chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.
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