插入损耗                        
                
                                
                        
                            绝缘体上的硅                        
                
                                
                        
                            材料科学                        
                
                                
                        
                            CMOS芯片                        
                
                                
                        
                            光电子学                        
                
                                
                        
                            回波损耗                        
                
                                
                        
                            电阻率和电导率                        
                
                                
                        
                            基质(水族馆)                        
                
                                
                        
                            蓝牙                        
                
                                
                        
                            电气工程                        
                
                                
                        
                            天线(收音机)                        
                
                                
                        
                            硅                        
                
                                
                        
                            电信                        
                
                                
                        
                            无线                        
                
                                
                        
                            工程类                        
                
                                
                        
                            海洋学                        
                
                                
                        
                            地质学                        
                
                        
                    
            作者
            
                C. Tinella,Joëlle Fournier,Didier Belot,V. Knopik            
         
                    
            出处
            
                                    期刊:IEEE Journal of Solid-state Circuits
                                                         [Institute of Electrical and Electronics Engineers]
                                                        日期:2003-07-01
                                                        卷期号:38 (7): 1279-1283
                                                        被引量:80
                                
         
        
    
            
            标识
            
                                    DOI:10.1109/jssc.2003.813289
                                    
                                
                                 
         
        
                
            摘要
            
            Taking full advantage of the high resistivity substrate and underlying oxide of silicon-on-insulator (SOI) technology, a high-performance CMOS single-pole double-throw (SPDT) T/R switch for Bluetooth class-II applications has been designed and fabricated in a partially depleted 0.25-μm SOI process. To compare the influence on losses and isolation of the substrate resistivity, the switch has been integrated above standard and high resistivity (20 /spl Omega//spl middot/cm and 1 k/spl Omega//spl middot/cm) substrates. The switch over the standard resistivity substrate exhibits 1 dB of insertion loss and 45dB of isolation at 2.4 GHz. With the high resistivity substrate, the overall performances are strongly improved until 0.7-dB insertion loss and a 54-dB isolation at 2.4 GHz. At 5 GHz, the switch over the high resistivity substrate keeps insertion loss and isolation at 1 and 46 dB, respectively. In both cases, the measured 1-dB input compression point is 12 dBm. The targeted Bluetooth class-II specifications have been fully fitted.
         
            
 
                 
                
                    
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