材料科学
非易失性存储器
数据保留
小型化
电阻随机存取存储器
计算机数据存储
晶体管
MOSFET
纳米技术
可靠性(半导体)
半导体存储器
光电子学
泄漏(经济)
栅氧化层
非易失性随机存取存储器
计算机科学
电气工程
计算机存储器
内存刷新
计算机硬件
电压
工程类
物理
功率(物理)
经济
宏观经济学
量子力学
作者
Xianghui Hou,Huawei Chen,Zhenhan Zhang,Shuiyuan Wang,Peng Zhou
标识
DOI:10.1002/aelm.201800944
摘要
Abstract With the rapid development of the information age, more and more new technologies such as big data and cloud computing are beginning to emerge. As a result, the demand for high data‐storage density is becoming more and more urgent. In the past 10 years, data‐storage density has been greatly improved by reducing the size of memory cells. However, as semiconductor technology nodes have shrunk, a number of problems have appeared in metal–oxide–semiconductor field‐effect transistor (MOSFET)‐based memory cells, such as gate‐induced drain leakage, drain‐induced barrier lowering, and reliability issues. Fortunately, due to their atomic thickness, high mobility, and sustainable miniaturization properties, 2D atomic crystals (2D materials) are considered the most promising substitute for silicon to solve those issues. This review investigates the use of 2D materials in nonvolatile and volatile memories, including MOSFET‐based memory, magnetic random‐access memory, resistive random‐access memory, dynamic random‐access memory, semi‐floating‐gate memory, and other novel memories.
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