金属间化合物
焊接
材料科学
接头(建筑物)
形态学(生物学)
有限元法
变形(气象学)
极限抗拉强度
复合材料
断裂(地质)
冶金
合金
结构工程
工程类
遗传学
生物
作者
Shuai Tian,Ruihua Cao,Jian Zhou,Feng Xue
标识
DOI:10.1109/icept.2017.8046445
摘要
The morphology of interfacial intermetallic compounds (IMCs) can have serious impact on the reliability of solder joints. This paper investigated the effect of interfacial IMC (Intermetallic Compound) morphology on mechanical properties of solder joint by finite-element method. The joint model is consisted of copper, Cu 6 Sn 5 interfacial IMC and Sn-3.0Ag-0.5Cu solder alloy. The surface of interfacial IMC was simplified into a cyclical one. In finite-element analysis, these joints with different interfacial IMC morphology were extruded to fracture. The results show that there are three stages for load-displacement curve of every kind of joint including quasi-elastic deformation stage, plastic deformation stage, and damage stage. Ultimate tensile load, fracture energy and interfacial crack length are influenced by the surface morphology of interfacial IMC.
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