热的
材料科学
RNA剪接
计算机科学
光电子学
化学
物理
生物化学
热力学
核糖核酸
基因
作者
Xiufeng Zhou,Yuan Pan,Ting Zhou,Guanghui Zhang,Yuan Ma
摘要
Glass‐based Micro‐LED direct‐view splicing screen has become a favorite in the high‐end display market due to its advantages such as high resolution, high contrast, seamless tiling, and exceptional image quality. Compared to printed circuit board (PCB)‐based direct‐view splicing screen, it utilizes active‐matrix (AM) technology to display images through a point‐to‐point direct drive method, effectively avoiding screen flickering and reducing harm and dizzy feelings to the human eyes. However, limited by the current low light efficiency of Micro‐LED, the screen suffers from heat generation issues, especially the high temperature at the signal input locations, which can even affect the display quality. This paper studies how to address the heat generation problem of the screen through thermal simulation from the aspects of heat dissipation materials, manufacturing processes, and structural design. Proposing optimization and improvement solutions ranging from manufacturing processes to module structural design. Effectively improve the local high‐temperature phenomenon at the signal input location, enhancing the temperature uniformity of the screen. Optimizing display visual effects and improving product reliability.
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