Heterogeneous Integration of Fiber-Based Copackaged Optics with EMIB Technology: Assembly, Performance, and Reliability

Co-packaged optics is an enabling technology to address the demand for high bandwidth and energy efficient data transmission in future data center applications. This report discusses our recent progress in heterogeneous integration of optical I/O and compute chiplets using Intel EMIB technology, in which fiber array unit and V-groove technology are used for optical I/O coupling. Our assembly process achieves low and stable insertion loss. The low insertion loss maintains after SAC reflow and does not show any significant degradation after JEDEC standard reliability stresses, including temperature cycling, unbiased highly accelerated stress test and high temperature storage. Additionally, the package passes mechanical shock and vibration test, which is critical for certain product segment. This report highlights the HVM-capable assembly and test of high performance, low insertion loss and high reliability fiber-based CPO packages.