材料科学
合金
降水
极限抗拉强度
电阻率和电导率
微观结构
再结晶(地质)
软化
冶金
相(物质)
沉淀硬化
铜
复合材料
化学
地质学
古生物学
物理
有机化学
气象学
电气工程
工程类
作者
Yunqing Zhu,Qian Yu,Lijun Peng,Xujun Mi,Haofeng Xie,Jibao Li,Zengde Li,Yicheng Cao
标识
DOI:10.1016/j.msea.2024.146098
摘要
Copper alloys with high strength and electrical conductivity are a key focus for next-generation electronic materials. In this study, a precipitation-strengthened Cu-0.96Ni-0.22P alloy with tensile strength, yield strength, and electrical conductivity values of 630 MPa, 614 MPa, and 64 % IACS, respectively, were designed via thermomechanical treatment. The nanoprecipitates remain in the form of the G.P zone during 450 °C aging from 30 to 120 min. Theoretical calculation results showed that the precipitation of coherent G.P zones contributes to a major strengthening to the Cu–Ni–P alloy. Coarsening of precipitates and recrystallization were the primary reasons for softening during the over-aged stage. The uniform growth of Ni2P phases was the main precipitation process during stable transformation, and the simultaneous precipitation of the Ni12P5 phase and a cube-like Ni3P phase was observed with a higher coarsening rate.
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