Pressure-Based Process Monitoring of Direct-Ink Write Material Extrusion Additive Manufacturing

喷嘴 挤压 材料科学 3D打印 过程(计算) 失真(音乐) 墨水池 压力传感器 主管(地质) 机械工程 工艺工程 质量保证 工程制图 计算机科学 复合材料 工程类 光电子学 放大器 运营管理 外部质量评估 CMOS芯片 地貌学 地质学 操作系统
作者
Jessica Kopatz,Derek Reinholtz,Adam Cook,Alexander S. Tappan,Anne Grillet
出处
期刊:Additive manufacturing [Elsevier BV]
卷期号:: 103928-103928
标识
DOI:10.1016/j.addma.2023.103928
摘要

As additive manufacturing (AM) has become a reliable method for creating complex and unique hardware rapidly, the quality assurance of printed parts remains a priority. In situ process monitoring offers an approach for performing quality control while simultaneously minimizing post-production inspection. For extrusion printing processes, direct linkages between extrusion pressure fluctuations and print defects can be established by integrating pressure sensors onto the print head. In this work, the sensitivity of process monitoring is tested using engineered spherical defects. Pressure and force sensors located near an ink reservoir and just before the nozzle are shown to assist in identification of air bubbles, changes in height between the print head and build surface, clogs, and particle aggregates with a detection threshold of 60-70% of the nozzle diameter. Visual evidence of printed bead distortion is quantified using optical image analysis and correlated to pressure measurements. This methodology provides an ability to monitor the quality of AM parts produced by extrusion printing methods and can be accomplished using commonly available pressure-sensing equipment.
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