Super-High Thermal Conductive Resin Sheet and Insulated Metal Baseplate Achieved by Card-House Structured BN Filler

Ceramic substrates have different CTE from copper and molding resin, thus there were issues such as durability of the copper junction and warpage of the substrate during mounting process. On the other hand, resin substrates (Insulated Metal Baseplate, IMB) have improved these issues with CTE equivalent to copper, but its heat dissipation was not sufficient for high heat dissipation ceramic substrates such as Si 3 N 4 and AlN. We have already mass-produced $16.5 \mathrm{W}/\mathrm{m}\cdot \mathrm{K}$ sheet with our originally developed "Card-house structured BN filler". Now, with further improvements, we have been developing $19 \mathrm{W}/\mathrm{m}\cdot \mathrm{K}$ sheet. This sheet is expected to show lower thermal resistance than Si 3 N 4 or AlN substrates owing to thick copper heat-dissipating substrates and removal of baseplate.