材料科学
多孔性
蒸发
复合材料
纳米线
纳米技术
多孔介质
化学工程
物理
热力学
工程类
作者
Myung‐Seo Kim,Seungwoo Shin,Woo Young Kim,Sang Hoon Lee,Seo Rim Park,Seok Kim,Young Tae Cho
标识
DOI:10.1007/s12541-024-01136-y
摘要
Abstract Numerous structures at the nano and microscale manifest distinctive properties with far-reaching implications across diverse fields, including electronics, electricity, medicine, and surface engineering. Established methods such as nanoimprint lithography, photolithography, and self-assembly play crucial roles in the fabrication of nano- and microstructures; however, they exhibit limitations in generating high-aspect-ratio structures when utilizing high-viscosity photocurable resins. In response to this inherent challenge, we propose a highly cost-effective approach facilitating the direct replication of high-aspect-ratio structures, specifically nanowires, through the utilization of anodized aluminum substrates. This study elucidates the streamlined fabrication process for multiscale porous surfaces achieved through the evaporation-induced integration of solid nanowires printed with high-viscosity photocurable resin.
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