Synthesis and properties of low dielectric and high thermostability benzocyclobutene silicone resin

Abstract In this paper, a kind of benzocyclobutene silicone resin was designed and synthesized successfully. The benzocyclobutene silicone resin showed a high thermal decomposition temperature at 443.6°C and a glass-transition temperature (Tg) higher than 350°C, which makes it used as a high-performance thermosets matrix. At the same time, the cured resins exhibited a relatively stable dielectric constant (≤ 2.65) and loss tangents (≤ 0.007) in the frequency from 2 GHz to 20 GHz, which exhibited an excellent wave transmissivity and the potential application in wave transmissivity fields.