电磁线圈
涡流
材料科学
陶瓷
稳健性(进化)
电感
参数统计
涡流传感器
温度测量
声学
电子工程
电气工程
复合材料
工程类
电压
基因
统计
量子力学
物理
生物化学
数学
化学
作者
Chandan Dutta,Tarun Kumar Das,Ranjit Hawaldar,Jayendra Kumar,S Palit Sagar
标识
DOI:10.1109/tim.2022.3216871
摘要
The investigation is focused on the parametric evaluation of a micro-fabricated Multi-Layer Planar (MLP) coil exposed to high temperature (≥ 600 °C). It can potentially be used as eddy current (EC) sensor for in-situ structural health monitoring (SHM) of critical engineering components. A detailed analysis of various contributing factors that affects the performance of the MLP coil is discussed. The coil is micro-fabricated on a ceramic substrate (DuPont L951 green tape) using state-of-the-art Low-Temperature Co-Fired-Ceramic (LTCC) technique. The stacked layer configuration (30 layers) soars the performance of the coil in terms of sensitivity and robustness. Emphasis is given on the performance both for dynamic & prolonged static thermal exposure. Delineation of electrical parameters particularly the series inductance (LS) of the sensor is found to be stable (~ 130 μH ±3%) up to 600 °C beyond which up to 800 °C, there is a decreasing trend (~ 70 μH ±3%). Also, the sensor shows stable and consistent behaviour with a nominal deviation of ± 1 % during prolonged thermal exposure. These findings throw light on the application of the MLP coil for in-situ SHM of critical engineering components exposed to high temperature.
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