材料科学
抗弯强度
陶瓷
烧结
热冲击
复合材料
热导率
六方氮化硼
氮化硼
纳米技术
石墨烯
作者
T. B. Wang,Cancan Jin,Jun Yang,Cong Hu,Tai Qiu
标识
DOI:10.1179/1743676114y.0000000226
摘要
Hexagonal boron nitride hBN ceramic was successfully fabricated by pressureless sintering at 2100C using submicrometre hBN powders without any sintering additive. The as-prepared hBN ceramic showed a room temperature flexural strength of 30.7MPa. Its flexural strength increased with the increment of temperature in N2 atmosphere, and it retained a strength of 57.2MPa nearly two times of the room temperature strength at 1600C due to clean grain boundaries with no glassy phase. Additionally, the as-prepared hBN ceramic showed a high thermal conductivity of 31.76Wm1k1 and a good thermal shock resistance, which retained a relatively high residual flexural strength of 22.6MPa 73.5 of the original flexural strength at T800C. The as-prepared hBN ceramic presents a good application prospect at high temperature.
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