感应耦合等离子体
肖特基势垒
溅射
蚀刻(微加工)
肖特基二极管
材料科学
分析化学(期刊)
离子
等离子体
二极管
击穿电压
化学
光电子学
电压
薄膜
纳米技术
电气工程
图层(电子)
工程类
物理
有机化学
量子力学
色谱法
作者
Jiancheng Yang,Shihyun Ahn,F. Ren,Raghav Khanna,Kristen Bevlin,Dwarakanath Geerpuram,S. J. Pearton,Akito Kuramata
摘要
Bulk, single-crystal Ga2O3 was etched in BCl3/Ar inductively coupled plasmas as a function of ion impact energy. For pure Ar, the etch rate (R) was found to increase with ion energy (E) as predicted from a model of ion enhanced sputtering by a collision-cascade process, R ∝(E0.5 – ETH0.5), where the threshold energy for Ga2O3, ETH, was experimentally determined to be ∼75 eV. When BCl3 was added, the complexity of the ion energy distribution precluded, obtaining an equivalent threshold. Electrically active damage introduced during etching was quantified using Schottky barrier height and diode ideality factor measurements obtained by evaporating Ni/Au rectifying contacts through stencil masks onto the etched surfaces. For low etch rate conditions (∼120 Å min−1) at low powers (150 W of the 2 MHz ICP source power and 15 W rf of 13.56 MHz chuck power), there was only a small decrease in reverse breakdown voltage (∼6%), while the barrier height decreased from 1.2 eV to 1.01 eV and the ideality factor increased from 1.00 to 1.06. Under higher etch rate (∼700 Å min−1) and power (400 W ICP and 200 W rf) conditions, the damage was more significant, with the reverse breakdown voltage decreasing by ∼35%, the barrier height was reduced to 0.86 eV, and the ideality factor increased to 1.2. This shows that there is a trade-off between the etch rate and near-surface damage.
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