Enhancement of IGZO TFT Performance via Metal-Induced Crystallization: A Pathway to High-Performance Next-Generation Displays

材料科学 结晶 光电子学 薄膜晶体管 性能增强 纳米技术 化学工程 医学 物理医学与康复 工程类 图层(电子)
作者
Sang Mook Kang,Byoungwoo Kim,Gwang‐Bok Kim,Jae Kyeong Jeong
出处
期刊:ACS Applied Materials & Interfaces [American Chemical Society]
卷期号:17 (33): 47230-47242
标识
DOI:10.1021/acsami.5c10418
摘要

This study demonstrates that IGZO compositions with low-indium (In) content can undergo effective crystallization via a low-temperature route. The IGZO films were initially thermally annealed at 400 °C to enhance structural quality, followed by titanium (Ti) metal-induced crystallization (MIC) at 300 °C under ambient oxygen conditions. Systematically varying the zinc (Zn) content in the IGZO channel while maintaining a fixed indium-to-gallium ratio revealed the relationship between microstructural evolution and electrical performance/stability. The optimized composition, In0.22Ga0.17Zn0.61O, enabled the formation of a highly aligned crystalline phase, resulting in excellent electrical performance in the corresponding thin-film transistors (TFTs), including a field-effect mobility of 73.4 ± 8.9 cm2/V·s, a near-zero threshold voltage (VTH) of 0.33 ± 0.48 V, and a low subthreshold swing of 174.9 ± 66.8 mV/decade. The devices exhibited consistent electrical characteristics across reproducibility tests on independently fabricated samples and aging tests after storage in ambient air for over three months. In addition, the devices demonstrated excellent operational stability under both positive- and negative-bias temperature stress (ΔVTH = +0.13 and -0.20 V, respectively) and strong stability under positive- and negative-bias illumination stress (ΔVTH = +0.23 and -0.28 V, respectively). Under constant current stress, the devices maintained a current retention rate of 98.79%, further confirming their robustness. In contrast, excessive Zn content induced ZnO phase separation, increased trap densities, and deteriorated device characteristics. These results highlight the pivotal role of Zn in governing crystallization behavior and defect control in oxide semiconductors. The MIC strategy employing Ti, an industry-compatible material, offers a scalable, low-temperature route to high-performance IGZO TFTs and a compelling alternative to conventional low-temperature polycrystalline oxide technologies for next-generation active-matrix organic light-emitting diode displays, including information technology, automotive, transparent, and flexible applications.
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