蚀刻(微加工)
铝
材料科学
过程(计算)
工艺工程
冶金
光电子学
纳米技术
计算机科学
工程类
图层(电子)
操作系统
作者
Qi Li,Qiang-Qiang Sang,Xueping Yao,Li-Tian Xu,Jiankun Zhang,Lisong Hu,Yi-Chang Liu,Chen Chen
标识
DOI:10.1109/cstic58779.2023.10219337
摘要
Aluminum etching by-products accumulate in the inner wall of the process chamber, the failure to remove such etching products would lead to the shift of chamber condition. In this regard, the paper has developed an efficient waferless auto clean (WAC) to facilitate the by-product removal of aluminum etching chamber. It is found that clean efficiency can be improved by the optimization of cleaning step sequence, the introduction of 4 CH in the 12 C cleaning step and the introduction of $\mathrm{C1} 2$ in the 2 O cleaning step
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