Comparative Analysis of Epoxy Molding Compound (EMC) Material Properties used in Double-sided Cooling Power Module

This paper presents an analysis approach comparing the influence of epoxy molding compound (EMC) materials to be used in doubles-sided cooling (DSC) power modules. Different from typical case-type power modules, a DSC power module is completed by molding process using the EMC. Thus, the DSC module's performance and reliability are anticipated to be largely determined by the used EMC's material properties and molding conditions. Though, such an EMC's impact is not easily analyzed because of the enormous variations of available EMC materials and their phase change occurring in the molding process. This study attempts to visualize key properties and conditions of EMC materials by simulating and comparing the quality of an example DSC power module (such as air trap or warpage) molded by example EMC materials.