A comparative study of strain and Ge content in Si<inf>1−x</inf>Ge<inf>x</inf> channel using planar FETs, FinFETs, and strained relaxed buffer layer FinFETs
拉伤
物理
生物
解剖
作者
C. H. Lee,Seibu Mochizuki,Richard G. Southwick,J. Li,Xin Miao,Ruqiang Bao,Takashi Ando,Rohit Galatage,S. Siddiqui,Catherine B. Labelle,Andreas Knorr,James H. Stathis,Dechao Guo,V. Narayanan,Bala Haran,Hemanth Jagannathan
标识
DOI:10.1109/iedm.2017.8268509
摘要
Strained Si 1-x Ge x channel pFinFETs and planar pFETs are fabricated on a strain relaxed buffer virtual substrate to comparatively study the electrical impact of strain and Ge content in the Si 1-x Ge x channel. By comparing the transistor electrical properties of Si 1-x Ge x pFETs on SRB with Si 1-x Ge x pFETs on Si substrate, we successfully decouple the influence of strain and Ge content in the Si 1-x Ge x channel on device performance such as gate stack quality, reliability, and carrier transport. Based on these understandings, dual channel Si/Si 1-x Ge x FinFETs on the SRB with the optimized surface orientation is proposed to further improve the device performance.