Enhancement of SPAD-camera sensitivity by molded microlens arrays

Single-photon avalanche diode (SPAD) sensors are versatile candidates for applications in low-light imaging and scenarios where high temporal resolution is crucial, like quantum imaging, fluorescence lifetime imaging, and (direct) time-of-flight methods. We demonstrate the improvement in light sensitivity by a factor of 7× for LiDAR (Light Detection and Ranging) by molding application-specific filling factor enhancing microlenses directly onto backside-illuminated SPADs. An 8"- wafer-level process is presented utilizing a mask aligner device for selective UV-curing of highly transparent polymer lenslets only in areas where SPADs are located and rinse uncured material from areas being compatible with postprocessing steps like chip dicing and electrical bonding. In addition to the optical benefits of chip-integrated lenslets, advantages arise from less system integration efforts of separately realized microlenses, especially with respect to tolerance conditions.