显微镜
材料科学
光学
光学显微镜
显微镜
衍射
原子力声学显微镜
波长
数值孔径
磁力显微镜
分辨率(逻辑)
反射(计算机编程)
光圈(计算机存储器)
剪切(地质)
光电子学
声学显微镜
热的
图像分辨率
剪切力
非接触原子力显微镜
信号(编程语言)
近场光学
作者
Mun Goung Jeong,Ilkyu Han,Dong Uk Kim,Chan Bae Jeong,Dongmok Kim,Ki Soo Chang
出处
期刊:Proceedings
日期:2025-11-07
卷期号:85212: 521-523
标识
DOI:10.31399/asm.cp.istfa2025p0521
摘要
Abstract A high-spatial-resolution thermoreflectance microscope based on shear force microscopy is demonstrated for thermal analysis of micro- and nano-electronic devices with spatial resolution beyond diffraction limit. To overcome the diffraction limit, a fiber-optic shear force microscope with an aperture smaller than the wavelength of the light source is established, and the optical fiber attached to the tuning fork is approached to the sample device (sub-micron-wide gold heater). The thermoreflectance microscope collects light reflected from the sample device through the aperture of the optical fiber. By analyzing the reflection signal that varies with respect to temperature and two-dimensional mapping of analysis results, high-spatial-resolution temperature distribution image is obtained. The developed high-spatial-resolution thermoreflectance microscope is expected to contribute to analyze device fault as well as localized thermal issues in micro- and nano-electronic devices.
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